Eng, Vol. 6, Pages 363: Influencing Factors and Control Measures for Post-Construction Settlement of High-Fill Red Clay Embankment
Authors:
Jian-Bin Xie
Bin Wu
Rong-Gu Jia
Yu-Chen Yang
Ke-Nu Li
Xue-Min Zhang
This study systematically investigates the post-construction settlement behavior of high-fill red clay embankments, focusing on the influences of three key factors (water content, degree of compaction, and lift thickness) and the effectiveness of geogrid-based reinforcement measures. A three-dimensional finite-element model based on the Mohr–Coulomb constitutive theory was established using MIDAS GTS NX 2022 R1 to simulate staged construction processes and long-term settlement under self-weight loading. The results indicate that settlement is predominantly concentrated in the upper fill zone adjacent to the slope surface, with displacement contours sagging inward toward the fill interior, while the underlying foundation undergoes negligible deformation. An elevated water content and reduced degree of compaction significantly enhance the compressibility of red clay, leading to increased settlement magnitudes and prolonged stabilization periods. Excessively thick lifts result in inadequate deep compaction, thereby inducing larger final settlements. Two reinforcement schemes (geogrid combined with anti-slide piles and geogrid combined with a gravity retaining wall) were verified to effectively mitigate post-construction settlement, with the former achieving a more pronounced improvement in the embankment stability coefficient. Based on the comprehensive analysis, optimal construction control parameters for high-fill red clay embankments are proposed: precise regulation of water content, maximization of compaction degree, and adoption of a lift thickness of approximately 30 cm. The findings of this study provide quantitative technical support and design references for the settlement control of similar high-fill red clay embankment projects in southern China’s mountainous and hilly regions.
Source link
Jian-Bin Xie www.mdpi.com
