JETA, Vol. 3, Pages 30: Thermal Performance of Silicone and Non-Silicone Thermal Pads as Thermal Interface Materials

Journal of Experimental and Theoretical Analyses doi: 10.3390/jeta3040030

Authors:
Chandan Roy
Landon Yarbrough
Hammad Quddus
Megan Batchelor

The research presents the thermal performance comparison of silicone and non-silicone thermal pads using a steady-state thermal interface material (TIM) testing apparatus. The TIM tester follows standard guidelines for testing thermal properties. TIMs are applied between two solid surfaces to improve heat transfer by eliminating air gaps that naturally occur due to surface roughness and non-flatness. Since TIMs possess significantly higher thermal conductivity than air, they effectively reduce contact resistance at the interface, thereby minimizing the risk of overheating in electronic systems. In this work, the thermal resistances of silicone and non-silicone thermal pads were compared over a pressure range of 10–50 psi. Results indicate that non-silicone pads consistently exhibit lower thermal resistance than their silicone counterparts under identical testing conditions.

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Chandan Roy www.mdpi.com