Materials, Vol. 18, Pages 5615: Comprehensive Structural and Interfacial Characterization of Laser-Sliced SiC Wafers

Materials doi: 10.3390/ma18245615

Authors:
Hong Chen
Seul Lee
Minseung Kang
Hye Seon Youn
Seongwon Go
Eunsook Kang
Chae-Ryong Cho

Laser slicing has emerged as a promising low-kerf and low-damage technique for SiC wafer fabrication; however, its effects on the crystal integrity, near-surface modification, and charge-transport properties require further clarification. Here, a heavily N-doped 4° off-axis 4H-SiC wafer was sliced using an ultraviolet (UV) picosecond laser, and both laser-irradiated and laser-sliced surfaces were comprehensively characterized. X-ray diffraction and pole figure measurements confirmed that the 4H stacking sequence and macroscopic crystal orientation were preserved after slicing. Raman spectroscopy, including analysis of the folded transverse-optical and longitudinal-optical phonon–plasmon coupled modes, enabled dielectric function fitting and determination of the plasmon frequency, yielding a free-carrier concentration of ~3.1 × 1018 cm−3. Hall measurements provided consistent carrier density, mobility, and resistivity, demonstrating that the laser slicing process did not degrade bulk electrical properties. Multi-scale Atomic Force Microscopy (AFM), Angle-Resolved X-Ray Photoelectron Spectroscopy (ARXPS), Secondary Ion Mass Spectrometry (SIMS), and Transmission Electron Microscopy (TEM)/Selected Area Electron Diffraction (SAED) analyses revealed the formation of a near-surface thin amorphous/polycrystalline modified layer and an oxygen-rich region, with significantly increased roughness and thicker modified layers on the hilly regions of the sliced surface. These results indicate that UV laser slicing maintains the intrinsic crystalline and electrical properties of 4H-SiC while introducing localized nanoscale surface damage that must be minimized by optimizing the slicing parameters and the subsequent surface-finishing processes.

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