Micromachines, Vol. 16, Pages 1213: Experimental and Numerical Study on Various Liquid-Cooled Heat Sinks Including Topology Optimization


Micromachines, Vol. 16, Pages 1213: Experimental and Numerical Study on Various Liquid-Cooled Heat Sinks Including Topology Optimization

Micromachines doi: 10.3390/mi16111213

Authors:
Ge Shi
Yanwei Dai
Zhongjun Yu
Xingyao Zeng
Cheng Tan
Haibo Zhang
Guang Yang
Fei Qin

With the rapid advancement in millimeter-wave antennas, heat dissipation of array heat sources faces significant challenges due to increasing requirements on power density and miniaturization. Efficient thermal management is essential to ensure reliability and performance, particularly in high-power applications such as millimeter-wave antennas. This study investigates liquid-cooled heat sinks featuring an inlet and outlet on the same side. A topology optimization method is employed to design an efficient heat sink, minimizing both average temperature and fluid dissipation. The optimized design is compared with common liquid-cooled heat sinks, including series, parallel, pin rib, and tree channels, through experimental and numerical simulations. A dedicated liquid-cooled experimental platform is developed to evaluate thermal and fluid characteristics under different flow rates. The results demonstrate that the topology optimization channels achieve superior thermal uniformity and lower pressure drop compared to traditional designs. The average temperatures of the heat sources in topology optimization I and II channels are 6% and 4% lower than those in the other flow channels, respectively, and the topology optimization I channel exhibits the most favorable fluid characteristics, with a pressure drop 9% lower than that of the parallel flow channel. Specifically, the topology optimization I and II channels exhibit balanced heat dissipation and flow resistance, while the series channel suffers from excessive pressure losses. The findings provide valuable insights for optimization, offering a practical method for enhancing thermal management in millimeter-wave antenna applications.



Source link

Ge Shi www.mdpi.com